Surface Mount Technology

AMI-Presco—stencil printers, IR conveyor dryers and material handling automation equipment

• Print solder paste materials for standard PCB component assembly
• Print adhesive for double sided component assembly

BTU International—IR conveyor furnaces for polymer thick films, BGA underfill applications, and wafer bumping

• Die Bonding and C4 wafer bumping process capability
• Cure potting, encapsulation and die underfill materials

Coining of America—brazing and solder alloy preforms; stamped to specification; cladding and plating; Extrusion and continuous casting

• Precious and Non-Precious brazing and soldering alloy preforms
• Preforms stamped to specifications

Conard Corporation—photochemical machining, finish operations include forming and plating

• Precision etched parts -- leadframes, flat lids, encoders, screens, RF shields, and covers
• Photoetching of exotic metals -- Aluminum, Magnesium, Monel, and Stainless Steel
• In-house capabilities include design, forming, laser welding, printing, and plating

Epoxy Technology—epoxies with ideal properties - electrical, thermal, and physical; applications include die attach, dam and fill, encapsulate, underfill, and potting (either rigid or flexible)

• Flex circuits, LCDs, LEDs, Medical/Dental, Fiber Optics, and many others
• Screen or stencil printable, stamp or dot, syringe dispense

Hybrid Screen Technologies—stencils, presensitized and imaged screens

• Stencils for solder paste applications -- laser cut or chem etched
• Stainless steel and Poly screens including trampoline mounting

Midas Technology—hot gas rework station for discrete component removal

• Specializing in high temperature/short duration component removal
• Isolate rework area to quickly break down bond
• Rework station protects nearby components from thermal damage

Nabertherm—Box ovens, lab furnaces, shuttle kilns, and high-temp furnaces

• Drying ovens and batch firing furnaces up to 1400C
• LTCC/MTCC/HTCC binder burn-off and sintering up to 1750C
• Array of lab furnaces specifically designed for professional applications
• Complete line of ovens, furnaces, and kilns for thermal application from 30C to 3000C

Pro-Mation, Inc.—automated material handling systems, selective laser soldering systems include fixture tooling, furniture, and assembly stations

• Automated material handling -- high speed routing & diverting, custom automated robotic assembly stations, and technical furniture
• Selective laser soldering -- for high mass components, flex-circuits, precision control and repeatable processing
• Capabilities include custom design, and layout to achieve production goals

Royce Instruments—universal bond testers and component handeling systems

• Universal bond tester -- wire pull, ball shear, die shear, metalization peel
• Semi-automatic epoxy die bonder -- precision placement with step and repeat
• Semi-automatic component handling -- bare die handling, step and repeat
• Fully automatic component handling -- wafer mapping handling of bare die