Hermetic Packaging and Optoelectronics

Coining of America—brazing and solder alloy preforms; stamped to specification; cladding and plating; Extrusion and continuous casting

• Precious and Non-Precious brazing and soldering alloy preforms
• Preforms, cladding and plating stamped to specifications

Conard Corporation—photochemical machining, finish operations include forming and plating

• Precision etched parts—leadframes, flat lids, encoders, screens, RF shields, and covers
• Photoetching of exotic metals—Aluminum, Magnesium, Monel, and Stainless Steel
• In-house capabilities include design, forming, laser welding, printing, and plating

Epoxy Technology—epoxies with ideal properties - electrical, thermal, and physical; applications include die attach, glob top, underfill, potting and more

• LCDs, LEDs, Medical/Dental, Fiber Optics, and many others
• Screen or stencil printable, stamp or dot, syringe dispense

Midas Technology—hot gas rework station for bonded component removal

• High temperature/short duration removal of epoxy and eutectic bonded components
• Accurate thermal control of rework area to protect nearby components

Miyachi Benchmark—flexible pick and place system for component handling

• Precision automated material handling pick, place, tack, and seal systems
• Precision alignment of laser diode caps
• Specifically designed for material handling of all hybrid packaging requirements

Nabertherm—Box ovens, lab furnaces, shuttle kilns, and high-temp furnaces

• Drying ovens and batch firing furnaces up to 1400C
• LTCC/MTCC/HTCC binder burn-off and sintering up to 1750C
• Array of lab furnaces specifically designed for professional applications
• Complete line of ovens, furnaces, and kilns for thermal application from 30C to 3000C

NorCom Systems—optical gross and fine leak testing of components

• Computer controlled laser holography for repeatable, automated processing
• Use of industry standard process boats and array tooling
• Meets requirements of MIL STD 883, Method 1014 and Telcordia
• Helium chamber gases can be recovered for maximum cost-efficiency in volume production

Royce Instruments—epoxy die bonder, die handling systems, laser bar stackers, and semi-automatic component pick and place systems

• Semi-automatic die bonder for low volume hybrid packaging requirements
• Precision component pick and place with step and repeat function
• Wafer and die handling systems with facet and under die inspection capability
• Fully automatic and semi-automatic component handling—bare die, wafer mapping
• Laser bar component handling system with die stacking function
• Universal die bond tester—wire pull, ball shear, die shear, metalization peel

SST International—void-free die/substrate attach using vacuum furnace

• Vacuum/pressure furnace for void-free die and substrate attachment
• Vacuum/pressure furnace for multi-step solder assembly of active and passive devices