AMI - Presco
Stencil & Screen Printers; IR Conveyor Dryers; Material handling automation
Dynatex International
Wafer scribe/break systems, process solutions, and dicing material supplies
Hybond, Inc.
Wire Bonders (Ball, Wedge and Peg/Beam) plus Die Bonders and Work Stages and Platforms for die packaging
Nabertherm
Box ovens, batch furnaces, binder burn-off & sintering kilns, and lab furnaces
Royce Instruments
Universal wire bond tester; Wafer/die handling; Programmable epoxy die bonder
Sefar
Stencils & Screens; Artwork services; Laser cut & Chem etched
Thinky Corp.
High performance mixing and defoaming systems from 1 ml to 10 kgs
NorCom Systems
Optical leak testing system; Laser halography; Gross & fine leak testing
BTU
IR conveyor furnaces &dryers; Conveyor convection curing ovens; Pusher kilns
Conard Corporation
Precision proto etched lids, leadframes, covers and shields
To view application examples
CLICK HERE
To download PTE line card
CLICK HERE
